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Solderability defects can result from poor line management, poor chemical management, incorrect deposit thickness (whether real or incorrectly measured), poor choice of chemical supplier, poor understanding of metallurgy and solderability, and/or a combination of all of these items Being able to measure solderability correctly and accurately is necessary for fixing these problems and for producing acceptable parts for the end user If the test always accepts the sample, or there is little to no discrimination between inputs to the line, the supplier will never develop a robust process and then will never supply parts with zero defects accordingly However, if the solderability test is performed correctly, data can be generated to determine whether significant relationships exist between two or more variables that have a positive or negative impact on the final product performance.

Ultra-precision machining processes fall under the nanotechnology regime Ion beam machining, is a process that functions at the atomic level, is known to be an ultra-precision machining process This inert gas ion process employs argon ions or other inert gas ions such as Kr and Xe at high kinetic energy levels of the order of 10 KeV to bombard and erode the surface of the workpiece By these means, the parent atoms are ejected by collision and emission by a phenomenon known as the ion sputter The penetration depth of an ion at 1 KeV as estimated from electron diffraction patterns is about 5 m The method neither generates heat to an intolerable level since the material removed is in units of atoms and in a random manner nor does it cause any significant mechanical strain damage in the machined surface layer Some of the argon ions are retained, substituting displaced workpiece atoms This process has a machining resolution of about 10 nm The ion-beam milling process (Figure 130), which uses a DC discharge, is a good example of an energy beam machining process

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These are known as analytic studies, as defined by Deming, and are used to increase the knowledge about the system of causes that affect the process These are considered among the most important uses of measurement data because they lead ultimately to better understanding of processes The benefit of using data-based procedures is largely determined by the quality of the measurement data used If the data quality is low, the benefit of the procedure is likely to be low, such as from dip and look solderability testing Similarly, if the quality of the data is high, the benefit is likely to be high also The quality of measurement data is related to the statistical properties of multiple measurements obtained from a measurement system operating under stable conditions For example, someone might be testing plated lead frames of varying deposit thicknesses and stressing the parts using steam exposure.

If there is a reduction in solderability, as a function of thickness and time exposure, then the data produced would be considered of high quality If there is no discrimination between any of the groups, and all pass or all fail, then the quality of the data would be considered low..

42.3.1 Commonly Used Statistical Properties The statistical properties most commonly used to characterize the quality of the data are bias and variance. Bias refers to the location of the data relative to the true value and variance refers to the spread in the data. Variance is a major player in producing low-quality data. Over the years, the science of evaluating pieces of test equipment and their suitability to accurately measure whatever they are being used for has evolved. By having a test that is scientifically and statistically believable, the results obtained can be trusted and thus correct

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