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and this was thought to provide the necessary range and usability for running a GR&R test. The results obtained from numerous round-robin industry studies have been terrible, with no correlation test site to test site or machine to machine from the same manufacturer being obtainable let alone obtaining an acceptable MSA, until the methodology and equipment was understood. A very detailed study was performed on the failed GR&R s of the past and an examination into the source of variation was undertaken. The results showed that slight misplacement of the test weight could have a huge impact on the result, especially in the lower weight ranges where small components are typically tested. Figure 42.3 shows normalized data from one round of testing with calibrated weights.The correct value should be 0.98 mN. It is clearly evident that the degree of spread and variation in this one-person test, which is typical for this type of test, would result in a rejection of the wetting balance as a scientifically acceptable measuring device for solderability force measurements.

1.06 1.05 1.04 1.03 1.02 1.01 Normalized mN 1.00 0.99 0.98 0.97 0.96 0.95 0.94 0.93 0.92 0.91 0100 mg 0200 mg 0400 mg Test weight

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As temperature variations can affect the accuracy of a process [20, 22], manufacturing engineers must pay attention to these variations when there is a need for accuracy and precision The thermal expansion of the components of a machine tool, which causes distortion, is an important factor that controls the precision of a machine tool The sources of heat may originate internally such as in bearings; machine ways, motors, and heat generated from the cutting zone, or may be external, such as from nearby furnaces, heaters, sunlight, and fluctuations in cutting and ambient temperature [6] The use of high-speed machining spindles with a coolant supply such as the one shown in Figure 131 is desirable [21] These considerations are particularly important in precision and ultra-precision machining, including diamond turning, where dimensional tolerances and surface finish have to necessarily be in the nanorange

FIGURE 42.3 Normalized data for one individual from a placing the test weights wetting balance test the correct value is 0.98 mN.

42.3.4 Wetting Balance Protocol to Meet the Requirements of an Acceptable GR&R What was needed was a test protocol that allowed the wetting balance to be used for what it was designed for: measuring solderability. This required producing a test sample that is considered uniform and consistent, sample to sample. This known good coupon was created and subsequently a test protocol developed. This detailed test protocol maybe found in the Appendix sections of the ANSI-JSTD-002 and ANSI-JSTD-003 documents. 42.3.4.1 Wetting Balance Protocol Development. This protocol was run using three types of wetting balance. To demonstrate the power of both the protocol and the wetting balance, three individuals were requested to run the test at every location: an expert in wetting balance

use, a technician who knew about the wetting balance, and someone who never even heard of solderability testing, let alone a wetting balance. Generally secretaries and customer sales people were used for this group. Figure 42.4 shows the results obtained for one wetting balance combining ten test per individual. A series of industry-wide, round-robin tests were conducted on three different manufacturers of wetting balance machines and among ten individuals. The results show that while there may be some performance differences from machine manufacturer to machine manufacturer, it is nothing that cannot be fixed now that a MSA-capable test protocol exists for the wetting balance. Based on the data produced, the test protocol was accepted by both the solderability specification committees and inserted into the next released revisions ANSI JSTD-002C and ANSI-JSTD-003B. Based on this work, the industry has a test protocol that stands up to any scrutiny pertaining to statistical GR&R and MSA evaluations or critiques.

FIGURE 42.4 An example of the consistency of wetting balance using the test protocol ten individuals participated in the generation of the previous data.

FIGURE 5.15 RST signal and the start of the program execution on an AVR processor. 2. Dallas Semiconductor Corp: DS1233. 3-pin reset generator. 350-ms pulse after Vcc

Fig 131:

42.3.4.2 The Output from a Wetting Balance. The output from a wetting balance test provides detailed information in both graphical and numerical formats. Depending on the software, multiple tests may be displayed on one graph, showing consistency or lack there of in the performance of a test group. Average values may also be displayed; some softwares even displays the contact angle. It also clearly distinguishes between non-wetting (soldering never took place) and de-wetting (soldering initially occurred but due to basis metal issues the solder could not remain wetted to the substrate). Figure 42.5 depicts the action of soldering using a wetting balance, the same motion applies if using a globule or immersing at an angle. Figure 42.6 shows the typical outputs from a wetting balance. a. b. c. d. e. f. Sample reaches the surface of the solder bath Sample at end of immersion depth (buoyancy) Forces at equilibrium Maximum wetting force Sample lifted out of the solder bath Sample is out of the solder bath

FIGURE 42.5 An example of the consistency of wetting balance using the test protocol ten individuals participated in the generation of the data.

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